• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    537 6 Summary A sensor module is provided having a wiring part with electrical conductivity, a first sensor element and a second sensor element, the first sensor element being arranged in a first receiving area of the wiring part and the second sensor element being arranged in a second receiving part and wherein the further conduit part has an area arranged between the first and the second receiving area, which force is applied in such a way that the second receiving area is directed at an angle relative to the first receiving area.
    公开号:SE537620C2
    申请号:SE1250286
    申请日:2012-03-22
    公开日:2015-08-11
    发明作者:Michael Hortig；Thomas Schrimpf
    申请人:Bosch Gmbh Robert；
    IPC主号:
    专利说明:

    537 6 Sensor module and accelerator production of a sensor module Prior art The invention is based on a sensor module according to the preamble of claim 1.
    Such sensor modules are generally known. For example, from the printed publication DE 10 2007 057 441 Al a sensor module is known, which has a sensor chip arranged on the back of a master card and a module housing. The sensor module can be contacted from the outside via a connection pin.
    From the printed publication DE 10 2007 052 366 A1 there is furthermore a bar element device with a first and a second bar element known, a first sensor being arranged on the first bar element and a second sensor being arranged on the second bar element. The first and second bar elements are formed as separate components, which are arranged perpendicular to each other. The arrangement of the first and second sensors perpendicular to each other allows feeding of at least two perpendicular vector quantities. In particular, a division of the quantities to be fed into at least two individual directional components is possible by means of the two sensors which are independent of each other and perpendicular to each other.
    Disclosure of the invention The inventive sensor module and the inventive method for manufacturing a sensor module according to the appended claims have, compared to the state of the art, the advantage, in a simple, space-compact and cost-effective manner to be realized, an angular arrangement of the first and second sensors is achieved. . On this sail, the feeding of vectorial quantities, such as accelerations, angular accelerations, magnetic fields, electric fields and the like along at least two deviating directions, is possible. In particular, this divides the division of a quantity to be fed into at least two individual directional components by means of the two sensor elements arranged at an angle to each other. In comparison with the state of the art, only a single conduit part is required, which is easily bent between the first and second receiving areas, i.e. angled or knocked. The use of two separate bar plates or sample cards is not necessary and a comparatively costly connection or joining technique for connecting such separate bar plates or sample cards is completely saved. The conduit part preferably comprises a metal insert part !. It is also conceivable that the wiring part includes a flexible printed circuit board. The first and second sensor elements preferably each comprise an electric, electronic, mechanical and / or micromechanical sensor, especially preferably an acceleration sensor, an angular acceleration sensor, a sensor for feeding an electric field and / or a sensor for feeding a magnetic field (e.g. a Hall sensor). The conduit portion bends in the adjacent area preferably according to the main extension plane of the conduit portion in the first receiving area and after the main extension plane of the conduit portion in the second reception area encloses an angle of substantially 900 or the angle is between 1 and 89 ° or between 91 and 179 °.
    Advantageous embodiments and further training of the invention are given in the subclaims, as well as in the description with reference to the drawings.
    According to a preferred embodiment, the first receiving area is arranged at an angle substantially 90 ° relative to the second receiving area. In an advantageous manner, a feeding of two mutually perpendicular and mutually independent quantities is thus possible.
    According to a preferred embodiment, the sensor module has a third sensor element, the third sensor element being arranged in a third receiving area, the conduit part having an additional bending area arranged between the second and the third receiving area, so that the third receiving area is angled relative to the second the reception area. Advantageously, by means of the third sensor element, feeding of vectorial quantities, such as, for example, accelerations, angular accelerations, magnetic field, electrical fait and the like, is possible along three mutually deviating spatial directions. In particular, this makes it possible to divide a quantity, which is to be fed, into all three directional components by means of three sensor elements arranged at an angle to one another. It is further conceivable for a plurality of first sensor elements to be arranged in the first receiving area, a plurality of second sensor elements in the second receiving area and / or a plurality of third sensor elements in the third receiving area.
    According to a preferred embodiment, the third receiving area is arranged substantially perpendicular to both the first receiving area and also to the second receiving area. This enables advantageous feeding in the three mutually independent spatial directions of a Cartesian coordinate system X, Y, Z.
    According to a preferred embodiment, the conduit part is arranged at least partially enclosed by a housing, which preferably comprises an injection-molded plastic material.
    The housing is produced in a relatively simple and cost-effective manner in an injection molding process (molding). Alternatively, however, the use of a prefabricated house, for example a Premold house, is also conceivable. The housing serves as protection for the sensor elements from external environmental influences, such as mechanical impact, moisture, acids or the like.
    According to a preferred embodiment, the conduit part has a first fastening clamp for fixing the first sensor element in the first receiving area, a second fastening clamp for fixing the second sensor element in the second receiving area and / or a third sensor for fixing the clamping member. in the third reception area. Advantageously, a comparative thing is thus achieved and simple manufacturable fixation of the sensor elements. The first, second and / or third mounting brackets are preferably each elastically biased toward the first, second and / or third receiving areas so that the first sensor member is clampable between the first mounting bracket and the first receiving member member, the second receiving member and the second receiving member bracket. the second receiving area and / or the third sensor element between the third mounting bracket and the third receiving area. This always results in a shape- and force-lasing fixation of the sensor elements. The mounting brackets comprise 3
    权利要求:
    Claims (5)
    [1]
    A sensor module (1), which has a conductive part (2) with an electrical conductivity, a first sensor element (4) and a second sensor element (4 '), the first sensor element (4) being arranged in a first receiving area ( 3) of the line part (2) and wherein the second sensor element (4 ') is arranged in a second receiving area (3') of the line part (2), the line part (2) having one between the first and the second receiving area (3, 3). ') arranged area (6), which is curved in such a way that the second receiving area (3') is directed at an angle relative to the first receiving area (3), the conduit part (2) being formed as a metal insert part, characterized by that the conduit part (2) has a first fastening clip (5) for fixing the first sensor element (4) in the first receiving area (3) and a second fastening clip (5 ') for fixing the second sensor element (4') in the second receiving area (3 '), or that lead the part (2) has a first fastening clip (5) for fixing the first sensor element (4) in the first receiving area (4), a second fastening clip (5 ') for fixing the second sensor element (4') in the second the receiving area (3 ') and a third mounting clip (5 ") for fixing the third sensor element (4") in the third receiving area (3 ").
    [2]
    Sensor module (1) according to claim 1, characterized in that the first receiving area (3) is angled substantially 90 ° relative to the second receiving area (3 ').
    [3]
    Sensor module (1) according to one of Claims 1 or 2, characterized in that the sensor module (1) has a third sensor element (4 "), the third sensor element (4") being arranged in a third receiving area (3). ") of the conduit part (2), the conduit part (2) having an additional area (6 ') arranged between the second and the third receiving area (3', 3"), which is bent so that the third receiving area (3 ") is angled relative to the second receiving area (3 ').
    [4]
    Sensor module (1) according to claim 3, characterized in that the third receiving area (3 ") is directed substantially perpendicular to both the first receiving area (3) and also the second receiving area (3 '). 537 620
    [5]
    Sensor module (1) according to one of the preceding claims, characterized in that the conduit part (2) is at least partially surrounded by a housing (8, 8 '), which preferably comprises an injection-molded plastic material. 10
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    同族专利:
    公开号 | 公开日
    SE1250286A1|2012-10-01|
    US20120247205A1|2012-10-04|
    CN102735280B|2017-07-11|
    CN102735280A|2012-10-17|
    DE102011006594A1|2012-10-04|
    引用文献:
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    US3487356A|1968-10-22|1969-12-30|Buck Eng Co Inc|Plural terminal and slip-on connectors|
    JP4151658B2|2005-02-18|2008-09-17|ヤマハ株式会社|Physical quantity sensor and lead frame used therefor|
    US20090056446A1|2007-09-05|2009-03-05|Cluff Charles A|Multiple-axis sensor package and method of assembly|
    DE102007052366B4|2007-11-02|2020-11-12|Robert Bosch Gmbh|Carrier element arrangement and method for producing a carrier element arrangement|
    DE102007057441B4|2007-11-29|2019-07-11|Robert Bosch Gmbh|Method for producing a micromechanical component with a volume-elastic medium and micromechanical component|
    DE102010031679A1|2010-07-22|2012-01-26|Robert Bosch Gmbh|Pressure sensor and method for producing a pressure sensor|DE102015209191A1|2015-02-10|2016-08-11|Conti Temic Microelectronic Gmbh|Mechatronic component and method for its production|
    DE102017214780A1|2017-08-23|2019-02-28|Conti Temic Microelectronic Gmbh|Sensor component, pre-assembly arrangement for a sensor component and method for producing a sensor component|
    US10451645B2|2018-03-12|2019-10-22|Veoneer Us Inc.|Remote sensor construction via integrated vacuum manufacture process|
    US10673184B2|2018-03-27|2020-06-02|Veoneer Us Inc.|Rigid electrical connection to strain sensitive sensing component|
    US10524367B2|2018-03-28|2019-12-31|Veoneer Us Inc.|Solderless sensor unit with substrate carrier|
    US10775402B2|2018-03-30|2020-09-15|Veoneer Us Inc.|Device with terminal-containing sensor|
    FR3083616A1|2018-07-06|2020-01-10|Airbus Operations|AIRCRAFT STRUCTURE COMPRISING A SENSOR WITH AN IMPROVED JUNCTION SYSTEM AND AIRCRAFT COMPRISING SAID STRUCTURE|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE102011006594A|DE102011006594A1|2011-03-31|2011-03-31|Sensor module and method for producing a sensor module|
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